🇵🇱 SIEĆ BADAWCZA ŁUKASIEWICZ - INSTYTUT PL
Electronics & EMCEnvironmentAutomotive
SIEĆ BADAWCZA ŁUKASIEWICZ - INSTYTUT is a laboratory accredited by PCA under number AB 045 (Warszawa, Poland). Its accreditation scope covers 18 test methods in the following areas: Electronics & EMC, Environment, Automotive. Test objects include: Low-voltage electronic and electrical products, Vehicles (vehicle c…, Printed circuit boards, Electronic components, printed circuit boards, electronic assemblie…, Printed circuit boards, soldered connections, electronic assemblies…. Most frequently used techniques: Energy-dispersive X-ray fluorescence spectrometry (ED-XRF), Electron microscopy method (SEM), Solution resistance measurement method.
At a glance
- Accreditation number: PCA AB 045
- Methods in scope: 18
- Types of test objects: 10
- Techniques used: 4
- City: Warszawa, Poland
- Accreditation number
- AB 045
- Accreditation body
- PCA
- Address
- TELE- I RADIOTECHNICZNY, LABORATORIUM BADANIA WYROBÓW ELEKTRONICZNYCH, ul. Ratuszowa 11
- City
- Warszawa, Poland
What this laboratory tests (10)
- Low-voltage electronic and electrical products, Vehicles (vehicle components) — 5 methods
- Printed circuit boards — 3 methods
- Electronic components, printed circuit boards, electronic assemblies (packages) — 2 methods
- Printed circuit boards, soldered connections, electronic assemblies (packages) — 2 methods
- Electrical measuring instruments, automation and laboratory devices — 1 method
- Electrical, telecommunications and electronic equipment — 1 method
- Electronic assemblies — 1 method
- Electronic components for surface mounting — 1 method
- Electronic components for through-hole assembly — 1 method
- Information technology and telecommunications equipment and office machines — 1 method
Analytical techniques used (4)
- Energy-dispersive X-ray fluorescence spectrometry (ED-XRF) — 2 methods
- Electron microscopy method (SEM) — 1 method
- Solution resistance measurement method — 1 method
- X-ray method — 1 method
Laboratory locations
- SIEĆ BADAWCZA ŁUKASIEWICZ - INSTYTUT (main site) — ul. Ratuszowa 11, Warszawa
- ELECTRONIC PRODUCTS TESTING LABORATORY — ul. Ratuszowa 11
Certificate information
- Issue date
- 22.09.2026
- Issue no.
- 25
Accreditation scope — test methods (18)
| No. | Test object | Methodology / Parameters | Technique | Reference document | |
|---|---|---|---|---|---|
| Electronic Products Testing Laboratory | |||||
| 1 | Electrical measuring instruments, automation and laboratory devices | Features and properties for the purposes of assessing the safety of use | PN-EN 61010-1:2011+ A1:2019-04* | PN-EN 61010-2-010:2015-01 | PN-EN IEC 61010-2-010:2020-10 | * Exclusions concern cl. 11.6, 11.7, 12, 13. | * Exclusions concern: 11.6. Specially protected devices 11.7. Fluid pressure and leakage 12. Protection against radiation 13. Protection against liberated gases, explosion and implosion | EN 61010-1:2010+A1:2019* | EN 61010-2-010:2014 | EN IEC 61010-2-010:2020 | * Exclusions concern: 11.6. Special protected devices 11.7. Fluid pressure and leak 12. Protection against radiation 13. Protection against gas emissions, explosion and implosion | ||
| 2 | Information technology and telecommunications equipment and office machines | Features and properties for the purposes of assessing the safety of use of electrical equipment | PN-EN 62368-1:2015-03* + A11:2017-09 + Ap1:2018-03 + AC1:2016-01 + AC:2017 | PN-EN IEC 62368-1:2020-11* + A11:2020-12+AC:2021-01 | PN-EN IEC 62368-1:2024-06/A11:2025-01* | * Exclusions concern chapters: 4.5, 4.8, 5.4.4.6.5, 5.4.12, 7.2, 8.5.4.2, 8.6.4 and annexes: C, G5.4, G13.6, S, U, Y | EN 62368-1:2014* + A11:2017 + AC1:2015 + AC:2017-12* | EN IEC 62368-1:2020/A11:2020* | EN IEC 62368-1:2024/A11:2024* | *Exclusions concern: p. 4.5, 4.8, 5.4.4.6.5, 5.4.12, 7.2, 8.5.4.2, 8.6.4 and annex: C, G5.4, G13.6, S, U, Y | ||
| 3 | Low-voltage electronic and electrical products, Vehicles (vehicle components) | Environmental testing – Cold (test A down to -65 °C) | PN-EN 60068-2-1:2009 | EN 60068-2-1:2007 | ISO 16750-4:2010 cl. 5.1 | ||
| 4 | Low-voltage electronic and electrical products, Vehicles (vehicle components) | Environmental testing – Dry heat (test B up to +160 °C) | PN-EN 60068-2-2:2009 | EN 60068-2-2:2007 | ISO 16750-4:2010 cl. 5.1 | ||
| 5 | Low-voltage electronic and electrical products, Vehicles (vehicle components) | Environmental testing – Damp heat, steady state (test Cab) Range (from 20 to 95) % RH Range (from 20 to 95) % RH |
PN-EN 60068-2-78:2013-11 | EN 60068-2-78:2013 | ISO 16750-4:2010 cl. 5.7 | ||
| 6 | Low-voltage electronic and electrical products, Vehicles (vehicle components) | Environmental testing – Damp heat, cyclic (test Db) Range (from 20 to 95) % RH Range (from 20 to 95) % RH |
PN-EN 60068-2-30:2008 | EN 60068-2-30:2005 | ISO 16750-4:2010 cl. 5.6 | ||
| 7 | Low-voltage electronic and electrical products, Vehicles (vehicle components) | Environmental testing - Change of temperature (test Na, Nb), - temperature step tests, - temperature cycling tests Range (from -60 to +160) °C Range (from -60 to +160) °C |
PN-EN 60068-2-14:2009+Ap1:2016-07 excluding cl. 9 | PN-EN IEC 60068-2-14:2024-04 excluding cl. 9 | EN 60068-2-14:2009 excluding cl. 9 | PN-EN IEC 60068-2-14:2024-04 excluding cl. 9 | ISO 16750-4:2010 cl. 5.2 | ISO 16750-4:2010 cl. 5.3 | ||
| 8 | Electrical, telecommunications and electronic equipment | Whiskers Length from 4 μm to 200 μm Length from 4 μm to 200μm |
Electron microscopy method (SEM) | PN-EN 60068-2-82:2019-10, Annex A | EN 60068-2-82:2018, Annex A | |
| 9 | Electronic components, printed circuit boards, electronic assemblies (packages) | Content of ionic impurities Range (0,3 - 10) μg NaCl/cm2 Range (0.3 - 10) μg NaCl / cm2 |
Solution resistance measurement method | IPC-TM-650 2.3.25 Rev D, p. 6 | |
| 10 | Electronic components, printed circuit boards, electronic assemblies (packages) | Content of Pb, Cd, Hg, Cr, Br Pb (392 - 1201) mg/kg Hg (203 - 1157) mg/kg Cd (90 - 337) mg/kg Cr (337 - 968) mg/kg Br (495 - 1110) mg/kg |
Energy-dispersive X-ray fluorescence spectrometry (ED-XRF) | IEC 62321 edition 1.0 | |
| 11 | Electronic components for through-hole assembly | Soldering - Test Ta | PN-EN 60068-2-54:2009 | PN-EN 60068-2-69:2017-07+A1:2020-01 | EN 60068-2-54:2006 | EN 60068-2-69:2017+A1:2019 | ||
| 12 | Electronic components for surface mounting | Soldering - Test Te | PN-EN 60068-2-69:2008 | PN-EN 60068-2-69:2017-07+A1:2020-01 | EN 60068-2-69:2007 | EN 60068-2-69:2017+A1:2019 | ||
| 13 | Printed circuit boards | Resistance to thermal shock and delamination | PN-EN 61189-3:2008 cl. 11.2, 11.4 | EN 61189-3:2008 cl. 11.2, 11.4 | ||
| 14 | Printed circuit boards | Solderability of through holes and solder lands | PN-EN 61189-3: 2008 cl. 12.10 | EN 61189-3: 2008 cl. 12.10 | JSTD-003B cl. 4.2.2 and cl. 4.2.7 | JSTD-003C cl. 4.2.1 and cl. 4.4.1 | JSTD-003D cl. 4.2.1 and cl. 4.4. | ||
| 15 | Printed circuit boards, soldered connections, electronic assemblies (packages) | Internal structure of the metallographic sample – cross section | IPC-TM-650 Rev E, p. 2.1.1 | IPC-TM-650 Rev F, p. 2.1.1 | IPC-A-600 Rev H, p. 3 | IPC-A-600 Rev J, p. 3 | IPC-A-600 Rev K, p.3 | IPC-A-610 Rev E, p. 7.3.5.1 | IPC-A-610 Rev F | IPC-A-610 Rev G | IPC-A-610 Rev GA | IPC-A-610 Rev H | IPC-A-610 Rev J | ||
| 16 | Printed circuit boards, soldered connections, electronic assemblies (packages) | Internal defects | X-ray method | Procedure A4 issue 1 of 28.04.2020 | Procedure A4 issue 1 from 28.04.2020 | |
| 17 | Electronic assemblies | The acceptability of soldered electronic connections | IPC-A-610 Rev E, cl. 5, cl. 7.3.5, cl. 8.3 and cl. 10.6 | IPC-A-610 Rev F | IPC-A-610 Rev G | IPC-A-610 Rev GA | IPC-A-610 Rev H | IPC-A-610 Rev J | ||
| 18 | Printed circuit boards | Thickness of Ni/Au coatings on Cu and Sn on Cu Au (0.0031 - 0.048) μm Ni (0.040 - 3.33) μm Sn (0.46 - 1.60) μm Cu (3.78 - 34.00 ) μm |
Energy-dispersive X-ray fluorescence spectrometry (ED-XRF) | Procedure A5 issue 1 of 27.04.2018 | Procedure A5 issue 1 of 27.04.2018 | |
Reference standards (67)
* Exclusions concern: 11.6. Special protected devices 11.7. Fluid pressure and leak 12. Protection against radiation 13. Protection against gas emissions, explosion and implosion
* Exclusions concern cl. 11.6, 11.7, 12, 13.
* Exclusions concern chapters: 4.5, 4.8, 5.4.4.6.5, 5.4.12, 7.2, 8.5.4.2, 8.6.4 and annexes: C, G5.4, G13.6, S, U, Y
* Exclusions concern: 11.6. Specially protected devices 11.7. Fluid pressure and leakage 12. Protection against radiation 13. Protection against liberated gases, explosion and implosion
*Exclusions concern: p. 4.5, 4.8, 5.4.4.6.5, 5.4.12, 7.2, 8.5.4.2, 8.6.4 and annex: C, G5.4, G13.6, S, U, Y
EN 60068-2-14:2009 excluding cl. 9
EN 60068-2-1:2007
EN 60068-2-2:2007
EN 60068-2-30:2005
EN 60068-2-54:2006
EN 60068-2-69:2007
EN 60068-2-69:2017+A1:2019
EN 60068-2-78:2013
EN 60068-2-82:2018, Annex A
EN 61010-1:2010+A1:2019*
EN 61010-2-010:2014
EN 61189-3: 2008 cl. 12.10
EN 61189-3:2008 cl. 11.2, 11.4
EN 62368-1:2014* + A11:2017 + AC1:2015 + AC:2017-12*
EN IEC 61010-2-010:2020
EN IEC 62368-1:2020/A11:2020*
EN IEC 62368-1:2024/A11:2024*
IEC 62321 edition 1.0
IPC-A-600 Rev H, p. 3
IPC-A-600 Rev J, p. 3
IPC-A-600 Rev K, p.3
IPC-A-610 Rev E, cl. 5, cl. 7.3.5, cl. 8.3 and cl. 10.6
IPC-A-610 Rev E, p. 7.3.5.1
IPC-A-610 Rev F
IPC-A-610 Rev G
IPC-A-610 Rev GA
IPC-A-610 Rev H
IPC-A-610 Rev J
IPC-TM-650 2.3.25 Rev D, p. 6
IPC-TM-650 Rev E, p. 2.1.1
IPC-TM-650 Rev F, p. 2.1.1
ISO 16750-4:2010 cl. 5.1
ISO 16750-4:2010 cl. 5.2
ISO 16750-4:2010 cl. 5.3
ISO 16750-4:2010 cl. 5.6
ISO 16750-4:2010 cl. 5.7
JSTD-003B cl. 4.2.2 and cl. 4.2.7
JSTD-003C cl. 4.2.1 and cl. 4.4.1
JSTD-003D cl. 4.2.1 and cl. 4.4.
PN-EN 60068-2-14:2009+Ap1:2016-07 excluding cl. 9
PN-EN 60068-2-1:2009
PN-EN 60068-2-2:2009
PN-EN 60068-2-30:2008
PN-EN 60068-2-54:2009
PN-EN 60068-2-69:2008
PN-EN 60068-2-69:2017-07+A1:2020-01
PN-EN 60068-2-78:2013-11
PN-EN 60068-2-82:2019-10, Annex A
PN-EN 61010-1:2011+ A1:2019-04*
PN-EN 61010-2-010:2015-01
PN-EN 61189-3: 2008 cl. 12.10
PN-EN 61189-3:2008 cl. 11.2, 11.4
PN-EN 62368-1:2015-03* + A11:2017-09 + Ap1:2018-03 + AC1:2016-01 + AC:2017
PN-EN IEC 60068-2-14:2024-04 excluding cl. 9
PN-EN IEC 60068-2-14:2024-04 excluding cl. 9
PN-EN IEC 61010-2-010:2020-10
PN-EN IEC 62368-1:2020-11* + A11:2020-12+AC:2021-01
PN-EN IEC 62368-1:2024-06/A11:2025-01*
Procedure A4 issue 1 of 28.04.2020
Procedure A5 issue 1 of 27.04.2018
Procedure A4 issue 1 from 28.04.2020
Procedure A5 issue 1 of 27.04.2018